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BGA2717
MMIC wideband amplifier
Rev. 02 -- 24 September 2004 Product data sheet
1. Product profile
1.1 General description
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package.
CAUTION This device is sensitive to electrostatic discharge (ESD). Therefore care should be taken during transport and handling.
MSC895
1.2 Features
s s s s s s s s Internally matched to 50 Wide frequency range (3.2 GHz at 3 dB bandwidth) Flat 24 dB gain (1 dB up to 2.8 GHz) -2.5 dBm output power at 1 dB compression point Good linearity for low current (IP3out = 10 dBm) Low second harmonic; -38 dBc at PD = -40 dBm Low noise figure; 2.3 dB at 1 GHz Unconditionally stable (K 2).
1.3 Applications
s s s s LNB IF amplifiers Cable systems ISM General purpose.
1.4 Quick reference data
Table 1: Symbol VS IS s21 NF PL(sat) 2 Quick reference data Parameter DC supply voltage supply current insertion power gain noise figure saturated load power f = 1 GHz f = 1 GHz f = 1 GHz Conditions Min Typ 5 8 24 2.3 1 Max 6 Unit V mA dB dB dBm
Philips Semiconductors
BGA2717
MMIC wideband amplifier
2. Pinning information
Table 2: Pin 1 2, 5 3 4 6 Pinning Description VS GND2 RF_OUT GND1 RF_IN
1 2 3
SOT363
Simplified outline
6 5 4
Symbol
1 6 4 2, 5
sym052
3
3. Ordering information
Table 3: Ordering information Package Name BGA2717 Description plastic surface mounted package; 6 leads Version SOT363 Type number
4. Marking
Table 4: BGA2717 Marking Marking code 1BType number
5. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VS IS Ptot Tstg Tj PD Parameter DC supply voltage supply current total power dissipation storage temperature junction temperature maximum drive power Tsp 90 C Conditions RF input AC coupled Min -65 Max 6 15 200 +150 150 -10 Unit V mA mW C C dBm
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
2 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
6. Thermal characteristics
Table 6: Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Ptot = 200 mW; Tsp 90 C Typ 300 Unit K/W
7. Characteristics
Table 7: Characteristics VS = 5 V; IS = 8 mA; Tj = 25 C; measured on demo board; unless otherwise specified. Symbol IS s21 2 Parameter supply current insertion power f = 100 MHz gain f = 1 GHz f = 1.8 GHz f = 2.2 GHz f = 2.6 GHz f = 3 GHz s112 s22 2 input return losses output return losses isolation noise figure bandwidth stability factor saturated load power load power f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz f = 1.6 GHz f = 2.2 GHz NF B K PL(sat) PL(1dB) f = 1 GHz f = 2.2 GHz at s212 -3 dB below flat gain at 1 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz at 1 dB gain compression; f = 1 GHz at 1 dB gain compression; f = 2.2 GHz IM2 second order at PD = -40 dBm; intermodulation f0 = 1 GHz product input, third order intercept point output, third order intercept point f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz Conditions Min 6 18 23 24 24 22 20 15 8 8 5 54 38 3 0 -1 -4 -5 36 Typ 8 18.6 23.9 25 25.1 24 22.1 19 9.4 10 6.8 55 39 2.3 2.9 3.2 13 1.7 1.4 +0.1 -2.6 -3.1 38 Max 10 20 25 27 27 26 24 2.5 3.1 dBm dBm dBm dBm dBc Unit mA dB dB dB dB dB dB dB dB dB dB dB dB dB dB GHz
s122
IP3in
-15 -20 9 4
-13.9 -18.8 10 6.3
-
dBm dBm dBm dBm
IP3out
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
3 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
8. Application information
Figure 1 shows a typical application circuit for the BGA2717 MMIC. The device is internally matched to 50 , and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased. The 22 nF supply decoupling capacitor C1 should be located as close as possible to the MMIC. The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as close as possible to the MMIC, and ideally directly beneath it. When using via holes, use multiple via holes, located as close as possible to the MMIC.
VS
C1
1 VS
C2
RF input
6 RF_IN
RF_OUT 3
C3
RF output
GND1
GND2
4
2, 5
mgu435
Fig 1. Typical application circuit.
Figure 2 shows the PCB layout, used for the standard demonstration board.
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
4 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
30 mm
PH
30 mm
PHILIPS
IN
OUT
V+
PH
DUT C2 C3
PHILIPS
IN
C1
OUT
V+
001aab255
Material = FR4; thickness = 0.6 mm, r = 4.6.
Fig 2. PCB layout and demonstration board showing components.
8.1 Grounding and output impedance
If the grounding is not optimal, the gain becomes less flat and the 50 output matching becomes worse. If a better output matching to 50 is required, a 12 resistor (R1) can be placed in series with C3 (see Figure 3). This will significantly improve the output impedance, at the cost of 1 dB gain and 1 dB output power.
9397 750 13293 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
5 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
VS
C1
VS
C2
RF input
RF_IN
RF_OUT
C3
R1
RF output
GND1
GND2
001aab346
Fig 3. Application circuit for better output impedance into 50 .
8.2 Application examples
The MMIC is very suitable as IF amplifier in e.g. LNBs. The excellent wideband characteristics make it an ideal building block (see Figure 4). As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution (see Figure 5).
mixer from RF circuit wideband amplifier oscillator
mgu438
to IF circuit or demodulator
Fig 4. Application as IF amplifier.
mixer antenna LNA wideband amplifier oscillator
mgu439
to IF circuit or demodulator
Fig 5. Application as RF amplifier.
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
6 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
90 +1 135 +0.5 +2 45 1.0 0.8 0.6 +0.2 0.4 0.2 180 0 0.2 0.5 100 MHz 2 5 10 0 0
4 GHz
+5
-0.2
-5
-135
-0.5 -1 -90
-2
-45 1.0
001aab265
IS = 8 mA; VS = 5 V; PD = -35 dBm; Zo = 50 .
Fig 6. Input reflection coefficient (s11); typical values.
90 +1 135 +0.5 +2 100 MHz +0.2 +5 0.4 0.2 180 0 0.2 0.5 1 4 GHz -0.2 -5 2 5 10 0 0 45 1.0 0.8 0.6
-135
-0.5 -1 -90
-2
-45 1.0
001aab266
IS = 8 mA; VS = 5 V; PD = -35 dBm; Zo = 50 .
Fig 7. Output reflection coefficient (s22); typical values.
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
7 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
0 |s12 | 2 (dB) -20
001aab267
30 |s21| 2 (dB) 20
001aab268
(2) (1) (3)
-40
10
-60 0 1000 2000 3000 f (MHz) 4000
0 0 1000 2000 3000 f (MHz) 4000
IS = 8 mA; VS = 5 V; PD = -35 dBm; Zo = 50 .
PD = -35 dBm; Zo = 50 . (1) IS = 8.9 mA; VS = 5.5 V. (2) IS = 8 mA; VS = 5 V. (3) IS = 7.2 mA; VS = 4.5 V.
Fig 8. Isolation (s122) as a function of frequency; typical values.
10 PL (dBm) 0
001aab269
Fig 9. Insertion gain (s212) as a function of frequency; typical values.
10 PL (dBm)
001aab270
(1) (2) (3)
(1)
0
(3)
(2)
-10
-10
-20
-20
-30 -50
-40
-30
-20
-10 PD (dBm)
-30 -50
-40
-30
-20
-10 PD (dBm)
f = 1 GHz; Zo = 50 . (1) VS = 5.5 V. (2) VS = 5 V. (3) VS = 4.5 V.
f = 2.2 GHz; Zo = 50 . (1) VS = 5.5 V. (2) VS = 5 V. (3) VS = 4.5 V.
Fig 10. Load power as a function of drive power at 1 GHz; typical values.
Fig 11. Load power as a function of drive power at 2.2 GHz; typical values.
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
8 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
4 NF (dB) 3
(3) (2)
001aab271
25 K 20
001aab272
15
2
(1)
10
1 5
0 0 500 1000 1500 2000 2500 f (MHz)
0 0 1000 2000 3000 f (MHz) 4000
Zo = 50 . (1) IS = 8.9 mA; VS = 5.5 V. (2) IS = 8 mA; VS = 5 V. (3) IS = 7.2 mA; VS = 4.5 V.
IS = 8 mA; VS = 5 V; Zo = 50 .
Fig 12. Noise figure as a function of frequency; typical values.
Fig 13. Stability factor as a function of frequency; typical values.
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
9 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
Table 8: Scattering parameters VS = 5 V; IS = 8 mA; PD = -35 dBm; Zo = 50 ; Tamb = 25 C. f (MHz) s11 Magnitude Angle (ratio) (deg) 100 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 0.074378 0.076338 0.123748 0.145511 0.134956 0.114063 0.101959 0.125656 0.16736 0.234721 0.285944 0.339673 0.393746 0.384353 0.376183 0.358586 0.345562 0.33312 0.331268 0.337502 0.344645 13.78537 13.70153 -1.402521 -31.32646 -67.10955 -111.2495 -168.8557 129.9717 85.791 51.43065 16.46701 -11.74152 -47.58817 -81.55786 -112.353 -142.5801 -171.7261 160.2254 133.8644 108.48 84.75183 s21 Magnitude Angle (ratio) (deg) 8.465495 9.420359 11.56481 13.31271 14.56872 15.61733 16.45625 17.05668 17.49643 17.90167 17.86635 17.96498 17.32414 15.87927 14.44081 12.67831 11.27597 10.43483 9.743293 9.072149 8.513716 22.90763 7.358555 -14.92222 -37.77988 -61.08808 -84.67015 -107.9167 -131.63 -155.2301 -179.6656 155.5993 130.5601 103.3297 77.84766 52.77053 30.51455 10.04765 -9.842264 -30.36495 -50.7401 -71.86536 s12 Magnitude Angle (ratio) (deg) 0.003859 0.003112 0.002011 0.001659 0.00169 0.002146 0.002901 0.004053 0.005545 0.007498 0.009779 0.011736 0.013927 0.015937 0.016795 0.01786 0.019217 0.020551 0.020908 0.022136 0.022792 -66.39435 -122.2687 -40.5142 -156.393 -164.4454 -174.8593 139.8136 123.527 107.0763 105.9423 90.10168 75.19814 53.10814 21.70136 4.656224 -19.19006 -32.22469 -49.16136 -59.65434 -78.78085 -94.87525 s22 Magnitude Angle (ratio) (deg) 0.450496 0.354179 0.312568 0.3038 0.30873 0.319208 0.335623 0.353582 0.366893 0.404064 0.42512 0.459194 0.459988 0.428158 0.393701 0.3497 0.30875 0.279672 0.248479 0.21362 0.168643 79.88713 40.70919 -0.3804 -25.36808 -46.7704 -68.71787 -91.58398 -116.5485 -140.7537 -167.9683 163.3173 135.039 103.1106 75.83004 50.16202 26.66791 6.504047 -12.63121 -33.64811 -56.42401 -80.24833 12.2 14.9 19.1 20.2 18.1 13.2 9.2 6.2 4.3 2.9 2.2 1.7 1.5 1.5 1.7 1.9 2.0 2.1 2.2 2.3 2.4 K-factor
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
10 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
9. Package outline
Plastic surface mounted package; 6 leads SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC EIAJ SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
Fig 14. Package outline; SOT363 (SC-88).
9397 750 13293 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
11 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
10. Revision history
Table 9: Revision history Release date 20040924 Data sheet status Product data sheet Change notice Doc. number 9397 750 13293 Supersedes BGA2717_N_1 Document ID BGA2717_2 Modifications: BGA2717_N_1
*
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors Preliminary data sheet 9397 750 12828 -
20040202
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
12 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
11. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
13. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 13293
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 -- 24 September 2004
13 of 14
Philips Semiconductors
BGA2717
MMIC wideband amplifier
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 4 Grounding and output impedance . . . . . . . . . . 5 Application examples . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information . . . . . . . . . . . . . . . . . . . . 13
(c) Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 24 September 2004 Document number: 9397 750 13293
Published in The Netherlands

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